induction cooker pcb board pcb assembly

induction cooker pcb board pcb assembly 1.No MOQ 2.Delivery time:2-3weeks 3.Certificates:UL,ISO9001:2000,RoHS

induction cooker pcb board pcb assembly

Layer: 2 Layers Material: ceramic , F4 BK-2 , Alu, Rogers, High Tg FR4, FR1, CEM-1, FR-4,etc

Board Thickness: 0.4-6.0 mm

Treatment : Lead Free HASL, ENIG, Immersion Tin, Immersion Silver, OSP etc. Solder Mask : Green, Red, White, Yellow, Black, Blue.

* We can provide quickturn prototype and small quantity PCBs with short lead time. * The quality of Our products is excellent and stable. * We choose the best material for all our products. * We will send the boards to you by DHL, TNT, UPS, FEDEX and so on to saving the transport time. * For responsing promptly, we will reply your e-mail from 9: 00am to 23: 00pm by two shifts. We sincerely hope to establish longtime and friendly business relationship with you. Good quality, reasonable price and the 5-Star service are guaranteed.

Surface Mount Assembly

Each assembly is profiled thermally prior to production; ensuring the reflow process adheres to both solder manufacturer and customer’s specifications.

We are capable of placing a wide range of standard and odd-form SMDs, from the smallest 0201 devices through CSPs, μBGAs, flip-chips and other components up to 38 mm x 38 mm, including 0.5 mm (20 mil) fine-pitch BGAs. Maximum PCB size is 1200mm * 240mme.g. LED Tube,LED Bar.

Pin Through Hole

Capabilities to place tape and reeled radial components sizes. Maximum PCB size is 25" x 25". Placement rates reach 5000 pieces per hour with an accuracy of 99% minimizing component loss.

Chip on Board Our COB packaging product line was put into production in October of 2004. Hongtai imported 12 sets of ASM-AB530 automatic ultrasonic & golden ball wire bonders, & automatic high precise die attaching machines which under our strict quality control, are used in our advanced clean room. serving hundreds of companies with high - quality COB packaging services, and bonding products such as remote control devices, keyboards, mice, MP3’s, smartcards, flash memory, medical equipments and more. We can produce 2000K COB packages monthly .

Board and System Level Testing

AOI Testing

·Checks for solder paste

·Checks for components down to 0201"

·Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection

X-Ray provides high-resolution inspection of:

·BGAs

·Micro BGAs

·Chip scale packages

·Bare boards

In-Circuit Testing

In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.

·Power-up Test

·Advanced Function Test

·Flash Device Programming

·Functional testing